Guest Post by Huan Lee, Lambient Technologies In the first post of this series, we saw in theory how ion viscosity changes as a thermoset cures, and how Critical Points can characterize the cure. Now let’s see how epoxy molding compound cures in reality. Samples of EMC were placed on a Lambient Technologies 1” Unitrode Sensor [Ref. 1], shown in Figure 1, then were compressed ... [Click to Continue...]
Dielectric Cure Monitoring Part One: Cure Monitoring of Epoxy Molding Compound (Part 1)
Guest Post by Huan Lee, Lambient Technologies Normally available in either B-staged powders or pellets for transfer molding, epoxy molding compound (EMC) is essential for electronics packaging and is used to encapsulate billions of integrated circuits each year. Figure 1. Granular (left) and pelletized (right) epoxy molding compound [Ref. 1] During cure of EMC, when ... [Click to Continue...]
Happy New Year
Happy New Year and Best Wishes for a Safe and Prosperous 2022! ... [Click to Continue...]
Happy Holidays
It's that time of the year for the Chemistree! Happy Holidays and Best Wishes for a Prosperous 2022! ... [Click to Continue...]
Welcome to Polymer Innovation Blog
Thank you for stopping by to visit my blog on polymers, plastics and innovation. I am in the process of developing new content. I will be blogging on product development, new advances in polymers, recycling/re-use and more. Please use the search feature on the right to look for content that may be of interest. I have over 400 posts on a variety of topics all related to ... [Click to Continue...]