Thermal interface materials (or TIMs) have been used extensively in a variety of electronic packaging to handle heat dissipation from the semiconductor chips as shown in Figure 1.
Figure 1. Schematic of thermal interface materials used in a flip chip package
Figure 1 shows a common ... [Click to Continue...]
Consulting is a great gig. I help companies increase revenues and profits, develop new products, increase manufacturing efficiency and lower scrap costs, leverage their intellectual property assets to protect their R&D investments and grow their businesses. At the end of the day, no matter what ... [Click to Continue...]
Figure 1. Non-conductive film (NCF) process flow (courtesy of Dow, ref )
The last post provided an introduction to non-conductive film used in wafer-level underfill. The image above from Dow Electronic Materials shows the overall process flow for a NCF. For the most part, the NCF materials ... [Click to Continue...]
Figure 1. Non-conductive Film process flow
The last post described the technical challenges when using capillary underfills. Pre-applied underfills or wafer-applied underfills are being developed. There are three types of pre-applied underfills:
Wafer level underfills that are coated onto ... [Click to Continue...]
Image from DuPont Electronic Solutions .
A previous post described the challenges associated with the future use of capillary underfills. The technical drivers for the next generation of underfills are:
Bump pitch going to less than 100 microns
Bump diameter is moving to less than 50 ... [Click to Continue...]
Figure 1. Unimicron UniSIP panel for heterogeneous integration (from ref ).
The Unimicron process (UniSIP) for heterogeneous integration in panel-level fan out packaging uses printed circuit board processes with a panel size of 508 mm x 508 mm as shown in Figure 1 (from ref ). An ... [Click to Continue...]