Polymer Innovation Blog

I was recently on a business trip to Hanoi Vietnam and like many large Asian cities, there were plenty of people on scooters as their primary means of transportation.  At first glance, it seemed to be total chaos with scooters, cars, buses all careening around the city streets.  In contrast to the ... [Click to Continue...]

Thermal interface materials (or TIMs) have been used extensively in a variety of electronic packaging to handle heat dissipation from the semiconductor chips as shown in Figure 1. Figure 1. Schematic of thermal interface materials used in a flip chip package Figure 1 shows a common ... [Click to Continue...]

Figure 1. Non-conductive film (NCF) process flow (courtesy of Dow, ref [1]) The last post provided an introduction to non-conductive film used in wafer-level underfill.  The image above from Dow Electronic Materials shows the overall process flow for a NCF.  For the most part, the NCF materials ... [Click to Continue...]

Figure 1. Non-conductive Film process flow The last post described the technical challenges when using capillary underfills.  Pre-applied underfills or wafer-applied underfills are being developed.  There are three types of pre-applied underfills: Wafer level underfills that are coated onto ... [Click to Continue...]

Image from DuPont Electronic Solutions [1]. A previous post described the challenges associated with the future use of capillary underfills. The technical drivers for the next generation of underfills are: Bump pitch going to less than 100 microns Bump diameter is moving to less than 50 ... [Click to Continue...]