Polymer Innovation Blog

Thermal interface materials (or TIMs) have been used extensively in a variety of electronic packaging to handle heat dissipation from the semiconductor chips as shown in Figure 1. Figure 1. Schematic of thermal interface materials used in a flip chip package Figure 1 shows a common ... [Click to Continue...]

Figure 1. Non-conductive film (NCF) process flow (courtesy of Dow, ref [1]) The last post provided an introduction to non-conductive film used in wafer-level underfill.  The image above from Dow Electronic Materials shows the overall process flow for a NCF.  For the most part, the NCF materials ... [Click to Continue...]

Figure 1. Non-conductive Film process flow The last post described the technical challenges when using capillary underfills.  Pre-applied underfills or wafer-applied underfills are being developed.  There are three types of pre-applied underfills: Wafer level underfills that are coated onto ... [Click to Continue...]

Image from DuPont Electronic Solutions [1]. A previous post described the challenges associated with the future use of capillary underfills. The technical drivers for the next generation of underfills are: Bump pitch going to less than 100 microns Bump diameter is moving to less than 50 ... [Click to Continue...]

Figure 1. Unimicron UniSIP panel for heterogeneous integration (from ref [1]). The Unimicron process (UniSIP) for heterogeneous integration in panel-level fan out packaging uses printed circuit board processes with a panel size of 508 mm x 508 mm as shown in Figure 1 (from ref [1]).  An ... [Click to Continue...]