The last post discussed the future transition to a panel format for Fan-Out Wafer Level Packaging.  The transition will occur over the next several years as the volumes ramp for wafer level packages.  Yole' Developpement has investigated the potential timing for the panel process.  Figure 1 shows the timing of panel R&D, sampling and low-volume manufacturing (LVM) and ... [Click to Continue...]

In this post we return to polymers in electronic packaging.  In October there were two electronic packaging conferences.  The International Microelectronics Assembly and Packaging Society (IMAPS) national conference was held in Pasadena, CA on October 8-11.  The second conference was the International Wafer Level Packaging Conference (IWLPC) which is held every year in San ... [Click to Continue...]

Guest Post by Dr. R. Bruce Prime and Dr. John Avila In this post we illustrate the p1 form described in Part 11 of this series by fitting conversion – rate of conversion data to a phenomenological equation based in chemical kinetics that is commonly used to describe autocatalytic cure kinetics. Such data can be measured by DSC although in these examples we generate the data ... [Click to Continue...]

Guest Post by Dr. R. Bruce Prime and Dr. John Avila This post explores how the epoxy-amine stoichiometry can affect the cure path of autocatalytic cure reactions, providing additional insight into the behavior of epoxy-amine thermosets. We illustrate some interesting benefits as well as precautions of altering the stoichiometry. For a variety of reasons it is not uncommon for ... [Click to Continue...]