Hot off the Press!

April 13, 2017 By Jeffrey Gotro 1 Comment

“Thermosets”

by

Jeffrey Gotro, Ph.D. and R. Bruce Prime, Ph.D.

Encyclopedia of Polymer Science and Technology

Published February 15, 2017

For more information click: http://onlinelibrary.wiley.com/doi/10.1002/0471440264.pst519.pub2/abstract

Dr. Prime is a former IBM colleague, a guest blogger on this site, and an InnoCentrix Principal Consultant. Bruce and I have been working together for many years starting with our work at IBM in the 80’s.

« Polymers in Electronic Packaging Part Three: Epoxy Mold Compounds for Fan-Out Wafer Level Packaging

Polymers in Electronic Packaging Part Four: Molding Process for Epoxy Mold Compounds for Fan-Out Wafer Level Packaging »

Comments

Jesse Dale Gimenez says

January 31, 2019 at 6:40 AM

Hi Sir,

How do you differentiate one type of epoxy on top of a wafer from the other?

I’m Dr. Jeff Gotro and welcome to the Polymer Innovation Blog. Over the last 40 years I have been involved in polymer research, along with product and process development. I acquired invaluable experience working for IBM, AlliedSignal, Honeywell, Ablestik Labs (now Henkel) and in multiple consulting projects. In this blog, I (along with some guest contributors) will share our experiences, tips, and “tricks of the trade” to get more out of your innovation efforts and discuss new trends and technical advances in the polymer industry.