The previous post covered an introduction to cyanate ester thermosetting resins. This post will discuss the main applications of cyanate ester thermosets.  In the 1980’s the main applications for cyanate esters were in electronic applications. Specifically, cyanate esters were used in high performance circuit boards and semiconductor substrates.  The substrate technical drivers ... [Click to Continue...]

The previous posts in this series covered various types of bismaleimide resins and formulations.  The next three posts will discuss cyanate ester resins and formulated products. Dicyanate resins, alternatively known as cyanate ester resins, describes both a family of monomers and oligomers with reactive cyanate end groups on an aromatic ring and the resulting cured resin ... [Click to Continue...]

The previous two posts covered aromatic BMI resins and curing mechanisms leading to highly crosslinked and high Tg thermosets.  Another important class of bismaleimides are liquid bismaleimides.   Liquid BMIs with long-chain aliphatic structures between the maleimide groups are used for low modulus, low Tg, high flexibility applications. For electronic applications, BMIs have ... [Click to Continue...]

This post is part two in a series on high performance thermosets and will cover aromatic bismaleimide curing chemistry. Bismaleimides are thermosetting polyimides that cure by addition reactions that avoid formation of volatiles. Unlike condensation polyimides (such as DuPont Kapton® or Ube Upilex®) where the polymerization mechanism results in the evolution of volatiles ... [Click to Continue...]

Epoxies have been a workhorse in the thermoset industry for decades. They offer a compelling cost/performance benefit in many applications.  This blog post series will cover other high performance thermosetting resins such as bismaleimides and cyanate esters.  Bismaleimides can be aliphatic such as used in high performance electronic adhesive systems or be aromatic where they ... [Click to Continue...]