A previous post touched briefly on dispersion techniques used to incorporate fillers into un-cured thermoset resins.  This post is the first in a series covering dispersion techniques.  Many commercially available thermoset-based products rely on fillers to provide significant property enhancements.  Fumed silica was shown to be a very effective rheology modifier when a yield ... [Click to Continue...]

Build-up film technology has been an integral part of high-density interconnect (HDI) circuit boards for decades.  As shown in the figure above, the build-up layers are used to fabricate fine lines and stacked vias in high density circuit boards.  One supplier is Ajinomoto Fine-Techno and the products they introduced have been termed “ABF” for Ajinomoto Build-Up Films.  Sekisui ... [Click to Continue...]

The last post described some of the new developments in film-based epoxy mold compounds from Hitachi Chemical (EBIS) and Ajinomoto (see image above courtesy of Ajinomoto Fine-Techno).  The main driver for panel level processing is to reduce cost.  Another area where there is an opportunity to reduce cost is in the redistribution layer process.  The main dielectrics used in ... [Click to Continue...]