Guest Post by Huan Lee, Lambient Technologies Normally available in either B-staged powders or pellets for transfer molding, epoxy molding compound (EMC) is essential for electronics packaging and is used to encapsulate billions of integrated circuits each year. Figure 1. Granular (left) and pelletized (right) epoxy molding compound [Ref. 1] During cure of EMC, when ... [Click to Continue...]
Happy New Year
Happy New Year and Best Wishes for a Safe and Prosperous 2022! ... [Click to Continue...]
Happy Holidays
It's that time of the year for the Chemistree! Happy Holidays and Best Wishes for a Prosperous 2022! ... [Click to Continue...]
Welcome to Polymer Innovation Blog
Thank you for stopping by to visit my blog on polymers, plastics and innovation. I am in the process of developing new content. I will be blogging on product development, new advances in polymers, recycling/re-use and more. Please use the search feature on the right to look for content that may be of interest. I have over 400 posts on a variety of topics all related to ... [Click to Continue...]
Happy Fourth of July
Happy Fourth of July for all my readers. Enjoy the long weekend with friends and family. ... [Click to Continue...]