In the last few posts in this series, we have been discussing polymer challenges in embedded wafer level packaging (eWLP).  The last topic to discuss is the redistribution layers and a few comments about manufacturing to achieve very high yield processes. First let’s talk about the polymer redistribution layers used in fan-out eWLP.  The key aspect of the fan out package is ... [Click to Continue...]

Guest Post by Dr. Robert Humphreys Consumers have grown accustomed to and even dependent on a superabundance of desirable, affordable products and technologies that address their every need for nutrition, comfort, shelter, health, pleasure, information, communication, transportation, education, and intellectual stimulation. On the other hand, it is the rare person who ... [Click to Continue...]

From all of us at Polymer Innovation Blog, we wish you and your family a Happy Thanksgiving. On another note, our post on Monday, November 25 was our 100th post.  A first milestone in our polymer journey. Thank you to all our readers who “tune in” and read our blog. ... [Click to Continue...]

In the last post in this series we introduced the embedded wafer level package concept.  In this post we will dive in a little deeper and look at the process and some of the polymer challenges. A high level overview may be seen in the next figure (source: ASE Group) The finished wafer is singlulated using traditional dicing methods to yield individual chips that are ... [Click to Continue...]

Guest Post by Dr. Robert Humphreys In previous posts, we have alluded to the immense complexity of the initiative to replace petroleum with biomass as the principal source of transportation fuels, chemicals, and polymer-based materials. Biomass pretreatment, the 5th step in the biomass-to-fuels-and-chemicals chain illustrated in Figure 1, provides perhaps the best example of ... [Click to Continue...]