I trust everyone had a nice relaxing and safe Thanksgiving Holiday.  In our last post we discussed the use of fillers to increase the thermal conductivity of thermosets.  In this post we will explore how fillers can be utilized to lower the coefficient of thermal expansion (CTE) in thermosets.  There are many examples of where CTE reduction is helpful and in the image ... [Click to Continue...]

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In many electronic applications, managing the heat dissipation is a challenge.  There are two important engineering functions of thermally conductive adhesives; heat spreading to avoid hot spots and heat transfer through a thermal interface material. In the image on the left, there are two thermal interface materials (TIM) being used.  One is in contact with the semiconductor ... [Click to Continue...]

Some thermoset polymers have useful properties in the as-cured condition.  However, many thermosets are modified using fillers to achieve the desired properties.  Fillers are used to: Lower coefficient of thermal expansion (CTE) Increase electrical conductivity Increase thermal conductivity Improve impact strength or fracture toughness Increase stiffness Reduce ... [Click to Continue...]