In the last post we introduced the concept of using a multi-modal particle size distribution to achieve very high packing densities (filler loadings) in thermoset compounds.  Remember that applications such as mold compounds, capillary underfills, and some types of encapsulants need to have a low coefficient of thermal expansion (CTE).  Epoxy resins (and other thermosets) ... [Click to Continue...]

In the last two posts we saw how important fillers can be in improving the properties of thermosets.  We have covered using thermally conductive fillers to enhance the thermal conductivity of thermoset formulations.  Additionally, we saw how the coefficient of thermal expansion (CTE) could be significantly lowered with judicious use of fillers.  In many cases it is advantageous ... [Click to Continue...]

  I trust everyone had a nice relaxing and safe Thanksgiving Holiday.  In our last post we discussed the use of fillers to increase the thermal conductivity of thermosets.  In this post we will explore how fillers can be utilized to lower the coefficient of thermal expansion (CTE) in thermosets.  There are many examples of where CTE reduction is helpful and in the image ... [Click to Continue...]

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In many electronic applications, managing the heat dissipation is a challenge.  There are two important engineering functions of thermally conductive adhesives; heat spreading to avoid hot spots and heat transfer through a thermal interface material. In the image on the left, there are two thermal interface materials (TIM) being used.  One is in contact with the semiconductor ... [Click to Continue...]