Over the last several posts we have been discussing how fillers can be used to significantly modify the physical properties of thermosets including lowering the coefficient of thermal expansion (CTE) and increasing the thermal conductivity. In this post we will discuss some ways fillers can be used to make electrically conductive thermosets. A good example of an electrically ... [Click to Continue...]
Fillers in Action: How to Achieve High Particle Loadings, Part Two
In the last post we introduced the concept of using a multi-modal particle size distribution to achieve very high packing densities (filler loadings) in thermoset compounds. Remember that applications such as mold compounds, capillary underfills, and some types of encapsulants need to have a low coefficient of thermal expansion (CTE). Epoxy resins (and other thermosets) ... [Click to Continue...]
Fillers in Action: How to Achieve High Particle Loadings
In the last two posts we saw how important fillers can be in improving the properties of thermosets. We have covered using thermally conductive fillers to enhance the thermal conductivity of thermoset formulations. Additionally, we saw how the coefficient of thermal expansion (CTE) could be significantly lowered with judicious use of fillers. In many cases it is advantageous ... [Click to Continue...]
Fillers in Action: Reducing the Coefficient of Thermal Expansion of Thermosets
I trust everyone had a nice relaxing and safe Thanksgiving Holiday. In our last post we discussed the use of fillers to increase the thermal conductivity of thermosets. In this post we will explore how fillers can be utilized to lower the coefficient of thermal expansion (CTE) in thermosets. There are many examples of where CTE reduction is helpful and in the image ... [Click to Continue...]
