Guest post by Jeremy Pasatta, Advanced Polymer Coatings Now that we have looked at the theory of toughening thermosets with second phase tougheners along with the two most common tougheners (RLP and coreshell particles) let’s look at how we measure the toughness of thermosets.  There are several different methods to measure the toughness of thermosets, and the method that is ... [Click to Continue...]

Guest post by Jeremy Pasatta, Advanced Polymer Coatings The previous two blog posts have looked at both the fundamentals of toughening thermosets as well as one of the most common technologies used to toughen thermosets – Reactive Liquid Polymers and CTBN.  In this blog post, we’ll look at toughening thermosets with coreshell particles. Coreshell particles are exactly as ... [Click to Continue...]

Join me at the IMAPS International Symposium on Microelectronics in October. I will be presenting a Professional Development Course on: Polymers for Wafer Level Packaging Monday, October 2 at 10:30 AM. Course Description The course has been completely updated to include a detailed discussion of the polymers and polymer-related processing for Fan-Out Wafer Level (FOWLP) ... [Click to Continue...]

Guest post by Jeremy Pasatta, Advanced Polymer Coatings In the previous blog post, we explored the reasons why thermosets benefit from the addition of second phase tougheners.  One of the most successful and widely used forms of second phase tougheners is Reactive Liquid Polymers, or RLP.  RLP can be any polymer that is low enough in molecular weight to be able to flow at room ... [Click to Continue...]

Guest post by Jeremy Pasatta, Advanced Polymer Coatings Thermosets such as epoxies, vinyl esters, cyanate esters, and benzoxazines give excellent properties such as chemical and thermal resistance, dimensional stability, high modulus and good adhesion to a variety of substrates.  These properties are in part due to the crosslink density of the thermoset, where in general the ... [Click to Continue...]