Guest post by Jeremy Pasatta, Advanced Polymer Coatings Previous blog posts on toughening have looked at the need for tougheners in thermosets, the two main toughening technologies, RLP and coreshell particles, along with methods of how to measure toughness and typical increases in toughness with RLP and coreshell particles.  In this blog post we will look at another form of ... [Click to Continue...]

Guest post by Jeremy Pasatta, Advanced Polymer Coatings Now that we have looked at the theory of toughening thermosets with second phase tougheners along with the two most common tougheners (RLP and coreshell particles) let’s look at how we measure the toughness of thermosets.  There are several different methods to measure the toughness of thermosets, and the method that is ... [Click to Continue...]

Guest post by Jeremy Pasatta, Advanced Polymer Coatings The previous two blog posts have looked at both the fundamentals of toughening thermosets as well as one of the most common technologies used to toughen thermosets – Reactive Liquid Polymers and CTBN.  In this blog post, we’ll look at toughening thermosets with coreshell particles. Coreshell particles are exactly as ... [Click to Continue...]

Join me at the IMAPS International Symposium on Microelectronics in October. I will be presenting a Professional Development Course on: Polymers for Wafer Level Packaging Monday, October 2 at 10:30 AM. Course Description The course has been completely updated to include a detailed discussion of the polymers and polymer-related processing for Fan-Out Wafer Level (FOWLP) ... [Click to Continue...]