In the last post, the processing of epoxy mold compounds (EMC) for standard leadframe packages, such as the Quad Flat Pack No Lead (QFN) shown on the left and PBGA packages was discussed.  Leadframe, PBGA and flip chip packages continue to be high volume products and as such mold compound technology has matured.  In the drive to have thinner electronic packaging, driven mainly ... [Click to Continue...]

Epoxy mold compounds provides a nice example of how thermoset chemistry and rheology can be used in a high volume electronic application.  Epoxy mold compounds (EMC) are highly filled epoxy-based formulations as discussed in the last post.  The processing of EMC provides several examples of how one can use vitrification and gelation to your advantage during processing.  EMC’s ... [Click to Continue...]

If you take the cover off your desktop PC (If you have one and I don’t recommend trying this on your laptop or phone!) you will see many components soldered to a printed circuit board (motherboard).  Many of these surface mounted devices are packaged semiconductor chips.  In electronics, the term packaging refers to the technologies used to route the electrical signals from the ... [Click to Continue...]

Source: Yole Developpement I attended the International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference held in Scottsdale, AZ the week of March 6, 2017.  The major theme of the technical sessions was the emergence of Fan-Out Wafer Level packaging in multiple applications.  The most prominent application driving the market was the TSMC ... [Click to Continue...]