This post will focus on the epoxy molding process using liquid and solid EMC for FOWLP.  In the image on the left, a liquid EMC is shown on the surface of the partially reconstituted wafer prior to compression molding (source: Nanium).  For FOWLP, the compression molding process is different compared with the transfer molding process typically used for EMC’s.  A schematic of ... [Click to Continue...]

In the last post, the processing of epoxy mold compounds (EMC) for standard leadframe packages, such as the Quad Flat Pack No Lead (QFN) shown on the left and PBGA packages was discussed.  Leadframe, PBGA and flip chip packages continue to be high volume products and as such mold compound technology has matured.  In the drive to have thinner electronic packaging, driven mainly ... [Click to Continue...]

Epoxy mold compounds provides a nice example of how thermoset chemistry and rheology can be used in a high volume electronic application.  Epoxy mold compounds (EMC) are highly filled epoxy-based formulations as discussed in the last post.  The processing of EMC provides several examples of how one can use vitrification and gelation to your advantage during processing.  EMC’s ... [Click to Continue...]

If you take the cover off your desktop PC (If you have one and I don’t recommend trying this on your laptop or phone!) you will see many components soldered to a printed circuit board (motherboard).  Many of these surface mounted devices are packaged semiconductor chips.  In electronics, the term packaging refers to the technologies used to route the electrical signals from the ... [Click to Continue...]