Source: Henkel The last post described the dicing die attach film (DDAF) approach used in multiple die stacking.  This post will discuss the application of DDAF and some of the interesting aspects of using the “bundled” die attach film on the dicing tape. In Figure 1, the die attach and stacking process is shown for a two-die stack.  The process begins with the placement of ... [Click to Continue...]

I trust everyone had a nice Fourth of July holiday and had some time to relax with family and friends.  We pick-up in this post with more information on film die attach.  As was discussed previously, the requirement for uniform, thin bondlines drives the die attach design.  Dicing Die Attach Film (DDAF) is the most common type of die attach film used in die stacking.  The DDAF ... [Click to Continue...]

The last few posts have been focused on die attach adhesives.  For leadframe and PBGA packages, dispensable paste die attach adhesives were used extensively and there are a wide variety of conductive (typically silver filled) and non-conductive (typically silica filled) adhesives on the market today.  Over the years, there was a continuous improvement in the performance and ... [Click to Continue...]

In the last post the history of epoxy die attach was discussed.  Up until the late 1990’s epoxy was the main thermoset resin used in both conductive and non-conductive die attach.  With the drive to get to higher JEDEC moisture sensitivity levels (level 2/260°C and eventually to level 1/260°C) resins with significantly lower moisture absorption were needed.  Additionally, ... [Click to Continue...]