The last post introduced flip chip ball grid array packages (FCBGA).  The key element from a polymer perspective is the use of an underfill to stabilize the solder balls or copper pillars used to electrically connect the IC chip to the substrate as seen in the schematic on the left.  Several processes have been developed to place the underfill under the flip chip.  The flow ... [Click to Continue...]

The last several posts discussed the semiconductor packaging technology progression from dual-in-line (DIP) using through hole mounting, to quad flat pack packages that were surface mounted, to area array plastic ball grid array (PBGA) that were also surface mounted.  As shown in the figure on the right, the first revolution was from through holes to surface mount.  The second ... [Click to Continue...]

The last post discussed advanced leadframe packages such as the QFP and QFN and introduced the plastic ball grid array (PBGA). The second major change in packaging technology occurred in the 1990’s when surface mount technology (SMT) was displaced by area array packages to achieve higher I/O density.  This post focuses on the details of the plastic ball grid array package ... [Click to Continue...]

The last post discussed leadframe packages that were some of the first semiconductor packaging approaches.  As the need for higher chip I/O, leadframe packages with more leads were developed.  To increase the lead count, leadframes were developed to have the leads on all four sides of the molded package.  These were termed Quad Flat Packs (QFP) since the leads came off all four ... [Click to Continue...]

With the thermoset basics behind us, the next series of posts will discuss the various types of electronic packages.  There is a very specific lexicon in the electronic packaging industry and it would help the reader to first get an understanding of the rationale for the various packaging types and then provide a detailed discussion around the polymers used in these packages.  ... [Click to Continue...]