Thank you to all of our veterans who have served over the years. Special tribute to my dad, the late Captain Douglas E. Gotro,, US Army, Korean War Veteran ... [Click to Continue...]
Thermal Interface Materials Part One: Introduction
Thermal interface materials (or TIMs) have been used extensively in a variety of electronic packaging to handle heat dissipation from the semiconductor chips as shown in Figure 1. Figure 1. Schematic of thermal interface materials used in a flip chip package Figure 1 shows a common configuration for a flip chip package. Two types of TIMs are used to facilitate heat ... [Click to Continue...]
Why Don’t Clients “Surrender?”
Consulting is a great gig. I help companies increase revenues and profits, develop new products, increase manufacturing efficiency and lower scrap costs, leverage their intellectual property assets to protect their R&D investments and grow their businesses. At the end of the day, no matter what type of consulting project, my main value is to lower risk. So why then do ... [Click to Continue...]
Enjoy Your Labor Day
To all my loyal readers, have a safe and relaxing Labor Day Weekend. ... [Click to Continue...]
Polymers In Electronic Packaging: Non-Conductive Film Underfill, Part Two
Figure 1. Non-conductive film (NCF) process flow (courtesy of Dow, ref [1]) The last post provided an introduction to non-conductive film used in wafer-level underfill. The image above from Dow Electronic Materials shows the overall process flow for a NCF. For the most part, the NCF materials are used in conjunction with copper pillar interconnects as shown in the top ... [Click to Continue...]